Copper-Compatible Thermal Expansion Lamination Plate

Copper-Compatible Thermal Expansion Lamination Plate

With a thermal expansion coefficient close to copper, this plate prevents copper foil wrinkling during CCL or FPC lamination.

Copper-Compatible Thermal Expansion Lamination Plate

1. Product Features

Huanyuchang is the general agent of Japanese metallurgical steel plate in South China.

Specializing in the deep processing of PCB, CCL, IC carrier board and other industrial use of the laminated steel plate

There are two types of steel plates : ordinary steel plate ( NAS630 precipitated hardening steel plate ) and high expansion coefficient steel plate ( NAS301 precipitated hardening steel plate ).

The company has its own processing center and production team, which can provide customers with one-stop service of vehicle, sales, processing and maintenance, so as to help improve customer quality and reduce customer cost.

We sincerely, honest, high-precision technology, a serious attitude towards each customer, so that we are satisfied with both customers.

Projects undertaken :

Pressing steel plate processing, leveling, grinding, polishing, trimming, repair

Usage : Used for PCB, CCL, FCCL, FPCB, aluminum substrate and other factories.

 

Copper-Compatible Thermal Expansion Lamination Plate
Copper-Compatible Thermal Expansion Lamination Plate

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