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Products
High Temperature Cushion Pad
——NAWES MAT ™
To support new 5G materials and high-standard bonding in electronics, while following industry environmental trends, our R&D team has launched NAWES MAT, a high-temperature cushioning material that replaces kraft paper.
Tooling Plate/ Carrier Plate
Tooling Plate/ Carrier Plate
We agent two imported bearing discs/covers: DILLIDUR-450 (Germany) and HARDOX-450 (Sweden), meeting MASSLAM & PINLAM machining accuracy and industry performance requirements.
Steel Press Plate/Separator Plate
We agent Japanese metallurgy & German mirror steel plates (original imports): NAS630, NAS301, 4120, 4310 (high expansion coefficient) precipitation hardening steels. Advantages: low cost, high parallelism, short delivery, QR traceability, fast technical service.
Release Film
Release film designed and manufactured for FPC and Rigid-Flex board production scenarios.
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Events & News
Whether Semiconductor Industry Requires High-Temperature resistance Materials or not?
Whether Semiconductor Industry Requires High-Temperature resistance Materials or not? The semiconductor industry relies on high-temperature resistance materials due to extreme manufacturing conditions. Key Reasons: High-Temperature Processes – Wafer bonding (300–1000°C),…
Meet Chang Universal Electronics at TPCA Show 2025 – Your Partner for High-Temp Lamination Solutions
Meet Shenzhen Chang Universal Electronics at TPCA Show 2025 – Your Partner for High-Temp Lamination Solutions SHENZHEN, CHINA – Shenzhen Chang Universal Electronics Co., Ltd., a…
PCB Press Cushion Pad, NAWES MAT Introduction.
Shenzhen Chang Universal Electronics Co., Ltd research & develop a new material : Press cushion pad. It is a revolutionary solution meticulously designed for the lamination processes…